G200
Supporting Literature
Tech Docs
Mechanical Properties
Tech Bulletin Lead Free Procedures
Processing Guide
G200 Process Guide.pdf
MSDS
G200 Laminate MSDS.pdf
G200 Prepreg MSDS.pdf
Product Bulletin
G200 Bulletin.pdf
Rohs Declarations
G200_2007_RoHs
G200 Material Declaration 2007
G200 PrePreg_2007_RoHs
BT/Epoxy Laminate and Prepeg
Isola laminate Systems' G200 is a fully proven laminate and prepeg system designed to meet today's high reliability printed circut board requirements. Blending bismaleimide/triazine and epoxy resin provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer countprinted wiring boards.
Performance and Processing Advantages
- Hi TG - 185 C (DSC)
Superior performance through multiple thermal excursions
Superior Chemical and thermal resistance - Low CTE from Ambient to 288 C
- Excellent Electrical Insulation in High Humidity and High Temperatures (CAF Resistance)
- Very Consistent Dimensional Stability
Purchasing Information
- Industry Approvals
IPC-1101C /30
File Number E41625 - Standard Availability
Thickness: 0.002" [.05mm] to 0.125" [3.2mm] Available in sheet or panel form - Copper Foil Cladding: Grade 3(HTE), 1/4 to 3 oz.
Foil Options: Double Treat
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2313, 2116, 1652 and 7628
