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P96 P26 P26N

Polyimide Laminate and Prepreg

Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Performance and Processing Advantages

• High Tg - 260 degrees C (TMA)
  Greater thermal performance over epoxy-bismaleimide blends
• Maintains Bond Strength at High Temperature
• Tough Resin System
  Improved processing due to less brittleness
  Less declamination from machining
• Flammability Rating V-0
• Non-MDA (Methylene Dianiline) Chemistry
  Meets all OSHA 1910.1050 requirements

Purchasing Information

• Industry Approvals
  IPC-4101C /41 /40 /42
  UL Recognized - GPY, File Number E41625
• Standard Availability
  Thickness: 0.0025" [.05 mm] to 0.125" [3.2 mm]
  Available in sheet or panel form
  Copper Foil Cladding: Grade 3 (HTE), 1/2, 1 and 2 oz.
  Foil Options: Double treat, Copper-Invar-Copper
  Prepregs: Available in roll or panel form
  Glass Styles: 106, 1080, 2113, 2116, and 7628