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FR408

Dielectric Solution for Improved Signal Performance

FR408 is a high-performance FR-4 epoxy laminate & prepreg systems designed for advanced circuitry applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 also brings the board reliability with its high Tg. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

Performance and Processing Advantages

• High Thermal PerformanceTg of 180 degrees C (DSC)
  Low CTE for reliability
• Improved Dielectric PropertiesDK less than 3.8 (50MHz - 1GHz) - Supports increased signal speeds
  DF less than 0.010 (50MHz - 1GHz) - Provides better signal integrity
• UV Blocking and AOI Fluorescence
  High throughput and accuracy during PBC fabrication and assembly
• Superior ProcessingClosest to conventional FR-4 processing of all high speed materials

Purchasing Information

• Industry ApprovalsIPC-4101C /24 /121 /124
  UL Recognized - FR-4, File Number E41625
  Qualified to UL's MCIL Program
• Standard Availability
  Thickness: 0.002" [.05 mm] to 0.093" [2.4 mm]
  Available in sheet or panel form
  Copper Foil Cladding: Grade 3 (HTE), 1/2, 1 and 2 oz.
  Foil Options: Reverse treat
  Prepregs: Available in roll or panel form
  Glass Styles: 106, 1080, 2113, 3313, 2116, 1652 and 7628