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Applications

• Antenna Applications
  Low dielectric constant and low dissipation factor products
• Automotive
  Products for standard and under-hood automotive applications
• Broadband Telecom
  High Tg substrates for Telecom backplanes and line cards.
• Buried Capacitance
• Burn in Board
• Controlled Dielectric
  Low DK/DF products with tight thickness control
• Down-Hole Drilling
  Polyimide products with high thermal stability and resistance in oil drilling industry
• Enhanced CAF
  Products with stable insulation resistance under high humidity and temperature conditions
• Halogen Free
  Bromine-free products
• HighTg
  Products with Tg > 170 Deg C
• Lead-Free
  Products with higher TD(Matrix Decomposition Temperature) and T-260 performance for lead-free assembly processes
• Military
  BT / no-flow and Polyimide products for military applications
• No-Flow
• RF / Microwave
  Low dielectric constant and low dissipation factor products
• Signal Integrity
  Low/stable DK/DF products for high data rate applications
• Thermal Cycling
  Low CTE (Alpha 1) products for higher thermal cycling resistance
• Thermal Reliability
  Products with high thermal resistance