Antenna Applications
Low dielectric constant and low dissipation factor products
| Product Name | Description | IPC 4101 Slash Sheet |
| Dura Flex -- Europe Only at this time | DURAFLEX-E-Cu Flexible base material for printed circuit board applications | IPC 4101 C /21 |
| FR408 | Modified epoxy: 180 C Tg, low dielectric constant, low dissipation factor | /24 /121 /124 |
| FR408HR | FR408HR Low DK/DF 230c Tg(DMA) Lead-free ROHS Compliant | /21, /24, /121, /124, /129 |
| GETEK | Low Dk Df, 175 C Tg, for High speed applications. PPO/Epoxy | /25 |
| IS620 | Glass reinforced : 215 C Tg Low Dk, Df | /30 |
| IS620i | Low Dk, Low Loss High Tg 225 C Lead-free | /30 |
| IS680 | IS680 meets or exceeds the needs for FR/Microwave designs with DK's of 2.80 - 3.55 Df values as low as .0020. Thermally stable, elctrically stable, cost competitive. |
