Broadband Telecom
High Tg substrates for Telecom backplanes and line cards.
| Product Name | Description | IPC 4101 Slash Sheet |
| 370 HR | Low CTE, FR-4 Epoxy system 180 C Tg | /21, /24, /26, /98 / 101 /126 |
| 370 TURBO | 175 C Tg, FR-4 Fast Cure, 350 C Td | /21, /24 /26 /121 /124 |
| Dura Flex -- Europe Only at this time | DURAFLEX-E-Cu Flexible base material for printed circuit board applications | IPC 4101 C /21 |
| FR406 | High-temp Epoxy: 170 C Tg | /21, /24 , /26, /28 |
| FR408 | Modified epoxy: 180 C Tg, low dielectric constant, low dissipation factor | /24 /121 /124 |
| FR408HR | FR408HR Low DK/DF 230c Tg(DMA) Lead-free ROHS Compliant | /21, /24, /121, /124, /129 |
| GETEK | Low Dk Df, 175 C Tg, for High speed applications. PPO/Epoxy | /25 |
| IS410 | Epoxy: 180 C Tg, CAF resistant, thermal resistant, lead-free | /21 /24 /26 /28 /121 /124 |
| IS415 | Modified epoxy: 200 C Tg, Lead free assembly compatible, Enhanced CAF with good electrical performance | /21/24 /26 /28 /121 /124 /129 |
| IS420 | IS420 low CTE 170 Deg C Tg lead free | /98 /99/101 |
| IS620 | Glass reinforced : 215 C Tg Low Dk, Df | /30 |
| IS620i | Low Dk, Low Loss High Tg 225 C Lead-free | /30 |
| IS680 | IS680 meets or exceeds the needs for FR/Microwave designs with DK's of 2.80 - 3.55 Df values as low as .0020. Thermally stable, elctrically stable, cost competitive. |
